# Thermal-Mechanic-Coupling

All files in this tutorial can be downloaded here.

This is a simple expampe of a beam bending under terperature load. It illustrates the forward coupling between a heat conduction analysis (computing the temperature field) and a subsequent mechanic analysis computing the displacement field due to temperature loading. The first sequence step is used to create a linear temperature distribution over the thickness of the beam. In the second step this is applied as an input for thermal strain. Due to the chosen mechanical boundary conditions there are considerable thermal stresses.

## Exercise Suggestions

To get familiar with the example

Additionally you can modify the example to

• compute the von-Mises equivalent stress
• choose boundary conditions at the left edge which do not over-constrain the vertical displacement. How do the results change?